Materials
CuCP

CuCP

Material Technology:

DMLS

Material Group

Copper

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CuCP

Pure copper, known for its high electrical and thermal conductivity, is an increasingly used material in DMLS additive technology. This process allows for the production of complex and detailed components with copper, preserving its distinctive properties. Common applications include precision electronic parts, such as heat sinks and connectors, as well as prototypes and customized components in the aerospace and automotive industries.

Alternative namings

-

Material Technology

DMLS

-

Material Group

Copper

-

Native color

-

Mechanical Properties

Elastic modulus

154 GPa

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Yield stress

160-162 MPa

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Tensile strength

223-227 MPa

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Elongation at break

34-38 %

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Hardness

-

Physical Properties

Density

8.9 g/cm³

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Melting temperature

1085 °C

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Maximum service temperature

651 °C

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Thermal conductivity

420 W/m·K

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Porosity

0.22 %

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Geometric Properties

Minimum roughness Ra

6.7 µm

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Tolerance

±0.25 (≤15mm); ±0.5 (>15mm) mm

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Layer height

-

Minimum detail achievable

0.6-0.8 mm

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Dimensions

Min Dimension [X]

-

Max Dimension [X]

250 mm

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Min Dimension [Y]

-

Max Dimension [Y]

250 mm

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Min Dimension [Z]

-

Max Dimension [Z]

290 mm

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Other

Flexural strength

-

Degradation temperature

-

Flexural modulus

-

Flamability

-

Impact strength

-

Water absorption

-

Izod impact notched

-

Purity

99.95 %

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Charpy impact

-

Electrical conductivity

99.6 %IACS

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Glass transition temperature

-

Surface resistance

-

Heat deflection temperature 045 mpa

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Volume resistivity

-

Heat deflection temperature 182 mpa

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