Material Technology:
DLP
Material Group
Resin
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High Temp is a photosensitive resin characterized by high thermal resistance, meaning it can withstand high temperatures without undergoing permanent deformation. It is particularly suitable for applications requiring heat resistance, such as engine components, mold parts, and items exposed to high temperatures. DLP technology enables precise and detailed printing, allowing the production of robust, heat-resistant components with a smooth, finished surface.
Alternative namings
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Material Technology
DLP
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Material Group
Resin
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Native color
amber, black
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Elastic modulus
4.0-4.1 GPa
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Yield stress
80 MPa
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Tensile strength
77-80 MPa
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Elongation at break
2.3-4 %
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Hardness
89-95 Shore D
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Density
1.2 g/cm³
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Melting temperature
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Maximum service temperature
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Thermal conductivity
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Porosity
-
Minimum roughness Ra
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Tolerance
±0.30 mm < 100mm ; ±0.3% > 100 mm mm
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Layer height
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Minimum detail achievable
0.5 mm
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Min Dimension [X]
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Max Dimension [X]
510 mm
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Min Dimension [Y]
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Max Dimension [Y]
280 mm
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Min Dimension [Z]
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Max Dimension [Z]
350 mm
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Flexural strength
85-140 MPa
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Degradation temperature
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Flexural modulus
3.3-4.3 GPa
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Flamability
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Impact strength
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Water absorption
0.36 %
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Izod impact notched
10-15.6 J
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Purity
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Charpy impact
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Electrical conductivity
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Glass transition temperature
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Surface resistance
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Heat deflection temperature 045 mpa
>200 °C
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Volume resistivity
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Heat deflection temperature 182 mpa
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Name
Material Technology
Material Group
All uploads are secure and confidential